The goal of this project was the investigation of sensor systems manufactured by company Endress&Hauser. The sensor system is a piezoresistive one and using a silicon sensor element.
For fabrication of this sensor element (100) silicon material was used. The piezoresistors have been fabricated by using implantation (Bor). After dicing and cleaning the silicon sensor
has been packaged by using standard packaging technologies. In order to get maximum performances, TO-chip carrier is used. The silicon sensor element is glued on the TO-8 carrier.
The performance of the sensor system is strongly depent on the properties of the used glue. The thermal mismatches have to be minimized.
In this project, diffirent glues have been used and their performances were evaluated and investigated.

• Prof. Dr.-Ing. Ha Duong Ngo (Projektleitung)

Endress & Hauser Messtechnik GmbH & Co. KG

• Endress & Hauser Messtechnik GmbH & Co. KG