Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
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Konferenzbeitrag Full Paper
Ngo, Ha Duong; Bickel, Jan: Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection. In: Microelectronics and Packaging Conference 2019. Hg. von IEEE. Pisa: 2019, S. 1-4.