Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB
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› 2019
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Konferenzbeitrag Full Paper
Ngo, Ha Duong; Wilke, Martin; Wöhrmann, Markus; Gernhard, Robert; Zoschke, Kai; Schneider-Ramelow, Martin; Lang, Klaus-Dieter: Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB. In: Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB . Hg. von IEEE. Singapore: IEEE 2019, S. 1-4.