Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices
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› 2019
Zitation
Konferenzbeitrag Full Paper
Ngo, H.-D.; Hu, X.; Schiffer, M.; Scneider-Ramelow, M.; Lang, K.-D.: Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices. In: Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices. Hg. von VDE. BERLIN: 2019, S. 1-4.