Platinum interconnections for harsh environment applications using atmospheric pressure sputtering

Konferenzbeitrag › Konferenzpaper › 2022

Zitation

Bickel, Jan; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Gesche, Roland; Ngo, Ha Duong: Platinum interconnections for harsh environment applications using atmospheric pressure sputtering. In: 2022 International Conference on Electronics Packaging (ICEP). Japan: IEEE 2022, S. 167-168.

ISBN

978-1-6654-8469-5

DOI / URN

10.23919/ICEP55381.2022.9795437

Link

http://www.jiep.or.jp/icep/

Sprache

Englisch

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BibTeX / RIS