Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate

Konferenzbeitrag › Konferenzpaper › 2022

Zitation

Ngo, Ha Duong; Erbacher, Kolja; AlvesMarques, Joao; von Krshiwoblozki: Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate. In: EPTC Advanced Packaging. Singapore: IEEE 2022, S. 1-4.

Link

https://www.eptc-ieee.net/

Sprache

Englisch

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