MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias

Konferenzbeitrag › Konferenzpaper › 2013

Zitation

Ngo, Ha Duong: MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias. In: Proceedings of SPIE 8763, Smart Sensors, Actuators, and MEMS VI. Hg. von SPIE. Grenoble, Frankreich: SPIE 2013, S. 6-11.

ISSN

0277-786X

Link

http://dx.doi.org/10.1117/12.2017159

Zitieren

BibTeX / RIS