MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias
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› 2013
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Konferenzbeitrag Full Paper
Ngo, Ha Duong: MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias. In: Proceedings of SPIE 8763, Smart Sensors, Actuators, and MEMS VI. Hg. von SPIE. Grenoble, Frankreich: SPIE 2013, S. 6-11.