Passivation of textured silicon wafers: Influence of pyramid size distribution, a-Si:H deposition temperature, and post-treatment

Artikel › Journalartikel › 2013

Zitation

Stegemann, Bert; Kegel, Jan; Mews, Mathias; Conrad, Erhard; Korte, Lars; Stürzebecher, Uta; Angermann, Heike: Passivation of textured silicon wafers: Influence of pyramid size distribution, a-Si:H deposition temperature, and post-treatment. In: Energy Procedia Volume 38. (2013), S. 881-889.

ISSN

1876-6102

Link

http://dx.doi.org/10.1016/j.egypro.2013.07.360

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