Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
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Mukhopadhyay, Biswajit; Mackowiak, Piotr; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Peter Herrmann,; Pohl, Olaf; Noack, Volker; Zhou, S.; Dao, Q. C.; Ngo, Ha Duong: Packaging solution for a novel silicon-based trace humidity sensor using coulometric method. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Hg. von IEEE. Singapore: 2016, S. 354-359.
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Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
IEEE EPTC Conference 2016
Singapure, 30.11.2016Veranstaltungsbeitrag › Sonstiger Veranstaltungsbeitrag › 2016