Packaging solution for a novel silicon-based trace humidity sensor using coulometric method

Konferenzbeitrag › Konferenzpaper › 2016

Zitation

Mukhopadhyay, Biswajit; Mackowiak, Piotr; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Peter Herrmann,; Pohl, Olaf; Noack, Volker; Zhou, S.; Dao, Q. C.; Ngo, Ha Duong: Packaging solution for a novel silicon-based trace humidity sensor using coulometric method. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Hg. von IEEE. Singapore: 2016, S. 354-359.

ISBN

978-1-5090-4368-2

Link

https://doi.org/10.1109/EPTC.2016.7861504

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