Characterization of Anodic Bondable LTCC for Wafer-Level Packaging

Konferenzbeitrag › Konferenzpaper › 2016

Zitation

Hu, Xiaodong; Baeuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Hansen, U.; Maus, S.; Mackowiak, Piotr; Mukhopadhyay, Biswajit; Vokmer, N.; Ngo, Ha Duong: Characterization of Anodic Bondable LTCC for Wafer-Level Packaging. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Hg. von IEEE. Singapore: 2016, S. 501-505.

ISBN

978-1-5090-4368-2

Link

https://doi.org/10.1109/EPTC.2016.7861529

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