A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer
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Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Fritz, Michael; Bäuscher, Manuel; Ngo, Ha Duong: A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer. In: Proceedings Smart Systems Integration, Cork, Ireland, 8 – 9 March 2017. Cork, Ireland: 2017, S. 98-105.
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A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer
Smartsystems Integration
Cork, Ireland, 08.03.2017Veranstaltungsbeitrag › Sonstiger Veranstaltungsbeitrag › 2017