Publikationen von Prof. Dr.-Ing. Ha Duong Ngo

Experimental study of hydrogen pipeline leakage using rGO and Pd-NP decorated H2-Sensors
Mutiu, Adesina Adegboye et al. In: Sensor Nürnberg. Nürnberg: 2024, S. 1-8.

Konferenzbeitrag › Konferenzpaper › 2024
High-Yield Large-Scale Suspended Graphene Membranes over Closed Cavities for Sensor Applications
Lukas, Sebastian et al. In: American Chemical Society (ACS) Nano 35/18/2024. (2024), S. 1-11.

Artikel › Journalartikel › 2024
Plasma-Based Additive Manufacturing Method for MEMS Using APSLD (Atmospheric Pressure Sputtering Layer Deposition) Technology
Bickel, Jan; Ngo, Ha Duong. In: IEEJ Transactions on Electrical and Electronic Engineering 9, 5. (2024), S. 915-919.

Artikel › Journalartikel › 2024
Screen-printed PVDF piezoelectric pressure transducer for unsteadiness study of oblique shock wave boundary layer interaction
Wang, Bei et al. In: MDPI Micromachines/E：Engineering and Technology 3228140/2024. (2024), S. 1-23.

Artikel › Journalartikel › 2024
Characterization of a Piezo-Resistive MEMS Microphone for Aero-Acoustic Measurements
Ngo, Ha Duong; Erbacher, Kolja. In: SMSI 2023 Conference – Sensor and Measurement Science International. Wunstorf: 2023, S. 171-172.

Konferenzbeitrag › Konferenzpaper › 2023
Dual-frequency piezoelectric MEMS microphones based on AlSc30%N thin films for aeroacoustic measurements
Ngo, Ha Duong et al. In: 2023 AIAA Aviation . (2023), S. 1-7.

Artikel › Journalartikel › 2023
Electronics design of piezo-resistive MEMS microphone arrays for aero-acoustics in flight tests
Ngo, Ha Duong et al. In: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP). Malta: 2023, S. 1-5.

Konferenzbeitrag › Konferenzpaper › 2023
Nano-Materials-Based Printed Glucose Sensor for Use in In-continence Products for Health-Care Applications
Ngo, Ha Duong et al. In: Micro . (2023), S. 1-17.

Artikel › Journalartikel › 2023
PLASMA-BASED ADDITIVE MANUFACTURING METHOD FOR MEMS USING APSLD (ATMOSPHERIC PRESSURE SPUTTERING LAYER DEPOSITION) TECHNOLOGY
Bickel, Jan et al. In: Trasducers 2023. Kyoto, Japan: 2023, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2023
Platinum interconnections for harsh environment applications using atmospheric pressure sputtering
Bickel, Jan et al. In: Trans. JIEP . (2023), S. E23-005-1-E21-005-11.

Artikel › Journalartikel › 2023
PVDF SENSOR ARRAYS FOR APPLICATIONS IN AEROSPACE
Ngo, Ha Duong. In: ECCOMAS Thematic Conference. Patras: 2023, S. 1-9.

Konferenzbeitrag › Konferenzpaper › 2023
Surface Time-Space investigation of a Mach 2 Turbulent SBLI by Means of a PVDF Piezo-Film Sensor Array
Ngo, Ha Duong et al. In: 2023 AIAA Aviation . (2023), S. 1-14.

Artikel › Journalartikel › 2023
Technologien der Mikrosysteme
Ngo, Ha Duong. Wiesbaden: Springer Nature 2023, S. 249.

Buch / Monographie › 2023
Aero Acoustic MEMS Microphone Integration in Ultra-Thin and Flexible Substrate
Ngo, Ha Duong et al. In: EPTC Advanced Packaging. Singapore: 2022, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2022
A Novel Piezoresitive Microphone MEMS Sensor For Aerospace Applications
Ngo, Ha Duong; Kolja Erbacher, Lixiang Wu, Bei Wang, Zirui Pang, Julien Weiss, Pablo Acedo. In: A Novel Piezoresitive Microphone MEMS Sensor For Aerospace Applications. Prague: 2022, S. 1-5.

Konferenzbeitrag › Konferenzpaper › 2022
Design and modeling of a novel piezoresistive microphone for aero acoustic measurements in laminar boundary layers using FEM and LEM
Erbacher, Kolja J. et al. In: AIAA 2022-1023. AIAA SCITECH 2022 Forum. San Diego: 2022, S. 1-6.

Konferenzbeitrag › Konferenzpaper › 2022
Design of dual-frequency piezoelectric MEMS microphones for wind tunnel testing
Wu, Lixiang et al. In: AIAA 2022-1023. AIAA SCITECH 2022 Forum. San Diego: 2022, S. 1-6.

Konferenzbeitrag › Konferenzpaper › 2022
Development of a PVDF Piezo-Film Sensor Array for Unsteady Wall-Pressure Measurements in a Turbulent SBLI
Cosimo Corsi et al. In: Development of a PVDF Piezo-Film Sensor Array for Unsteady Wall-Pressure Measurements in a Turbulent SBLI . (2022), S. 1-12.

Artikel › Journalartikel › 2022
Harsh environment interconnection technology for three-dimensional packaging
Bickel, Jan et al. In: iMaps Plus 2/2022, PLUS Elektronikfertigung. (2022), S. 1-2.

Artikel › Journalartikel › 2022
Herstellung eines piezoresistiven Drucksensors aus Siliziumcarbid mittels reaktiven Ionenätzen
Ngo, Ha Duong, P. Mackowiak, K. Erbacher, M. Bäuscher, K. Höppner, M. Schiffer,. In: Herstellung eines piezoresistiven Drucksensors aus Siliziumcarbid mittels reaktiven Ionenätzen. Nürnberg: 2022, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2022
Platinum interconnections for harsh environment applications using atmospheric pressure sputtering
Bickel, Jan et al. In: 2022 International Conference on Electronics Packaging (ICEP). Japan: 2022, S. 167-168.

Konferenzbeitrag › Konferenzpaper › 2022
Development, Simulation and Characterization of a novel Incontinence Sensor System using 2D-Printing Technology with Conductive Polymer PEDOT:PSS
Ngo, Ha-Duong et al. In: Printed and Flexible Sensor Technology.Fabrication and applications. London: 2021, S. 1-16 (14).

Sammelbandbeitrag › Aufsatz › 2021
Dual-Rotor Electromagnetic-Based Energy Harvesting System for Smart Home Applications
Dinulovic, Dragan et al. In: IEEE Transactions on Magnetics Vol. 57, 2. 2021. (2021), S. 1-5.

Artikel › Journalartikel › 2021
Investigation of Deep Dry Etching of 4H SIC Material for MEMS Applications Using DOE Modelling
Erbacher, K. et al. In: 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS), 2021. o. O.: 2021, S. 634-637.

Konferenzbeitrag › Konferenzpaper › 2021
Novel rGO-based gas sensor platform for low-power gas sens-ing applications
Ngo, Ha Duong. In: Chemistry Proceedings. o. O.: 2021, S. 1-5.

Konferenzbeitrag › Konferenzpaper › 2021
Quantum Capacitance Transient Phenomena in High-K dielectric Armchair Graphene Nanoribbon Field-Effect Transistor Model
Avnon, Asaf et al. In: Solid-State Electronics Vol. 184/2021. (2021), S. 1-4 (108060).

Artikel › Journalartikel › 2021
Recent Advances and Challenges of nanomaterials based Hydrogen Sensors
Ngo, Ha Duong et al. In: Special Issue. Micromachines 12, no. 11. (2021), S. 1-62.

Artikel › Journalartikel › 2021
Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS
Wang, B. et al. In: Special Issue Nanomaterial and Nanostructure-Enabled On-Chip Sensing Micromachines 2020, 11, 474. (2020), S. 1-15.

Artikel › Journalartikel › 2020
Dual-Rotor Electromagnetic Based Energy Harvesting System for Smart Home Applications
Dinulovic, Dragan et al. In: IEEE Transactions on Magnetics. Canada: 2020, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2020
Investigation of Etching SIC VIAS for High Power Elctronics and Harsh Enviornment Mems
Mackowiack, Piotr et al. In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). Tønsberg, Vestfold, Norway: 2020, S. 1-6.

Konferenzbeitrag › Konferenzpaper › 2020
Real-Time Impedance Monitoring of Epithelial Cultures with Inkjet-Printed Interdigitated-Electrode Sensors
Mojena-Medina, Dahiana et al. In: Sensors 2020 20, 5711. (2020), S. 1-22.

Artikel › Journalartikel › 2020
An All-Inkjet-Printed Photosensor On Flexible Plastic Substrate For The Detection Of Ultraviolet Radiation
Ngo, Ha Duong; Kaufhold, Robin. In: An All-Inkjet-Printed Photosensor On Flexible Plastic Substrate For The Detection Of Ultraviolet Radiation. Barcelona: 2019, S. 1-6.

Konferenzbeitrag › Konferenzpaper › 2019
Editorial for the Special Issue on MEMS Accelerometers
Ngo, Ha Duong et al. In: Special Issue "MEMS Accelerometers" Micromachines 2019, 10, 290. (2019), S. 1-4.

Artikel › Editorial › 2019
Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB
Ngo, Ha Duong et al. In: Fabrication of High Voltage Capable TSV using Backside Via Last Process and Laser Abblation of Dry Film BCB . Singapore: 2019, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2019
High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Ngo, Ha Duong et al. In: High Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications. USA: 2019, S. 1-6.

Konferenzbeitrag › Konferenzpaper › 2019
Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
Ngo, Ha Duong; Bickel, Jan. In: Microelectronics and Packaging Conference 2019. Pisa: 2019, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2019
Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
Ngo, H. D.; Bickel, J.; Eberl, M.-L.; Kaletta, K.; Schneider-Ramelow, M.; Lang, K.-L. In: Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications. BERLIN: 2019, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2019
MEMS Accelerometers
Hg. von Mahmoud Rasras et al. Basel: MDPI 2019, S. 252.

Herausgeberschaft Buch / Sammelwerk › 2019
Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Ngo, Ha Duong et al. In: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII). Berlin: 2019, S. 793-796.

Konferenzbeitrag › Konferenzpaper › 2019
Neue grenzenlose Möglichkeit in den additiven Herstellungstechnologien
Bickel, Jan; Ngo, Ha-Duong. In: Grenzen in Zeiten technologischer und sozialer Disruption. Berlin: 2019, S. 50-55.

Sammelbandbeitrag › Aufsatz › 2019
Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices
Ngo, H.-D.; Hu, X.; Schiffer, M.; Scneider-Ramelow, M.; Lang, K.-D.. In: Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Devices. BERLIN: 2019, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2019
3D Wire - a novel approach for 3D Chips Interconnection for Harsh Environment Applications
Ngo, Ha Duong; J. Bickel. Dresden: 2018, S. 100-105.

Konferenzbeitrag › Konferenzpaper › 2018
Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh et al. In: Kreativität + X = Innovation. Berlin: 2018, S. 214-221.

Sammelbandbeitrag › Aufsatz › 2018
Alterungsphänomene beim Al-Drahtbonden mit semiautokatalytisch abgeschiedenem Gold auf chemisch Ni-Schichten
Ngo, Ha Duong, Martin Schneider-Ramelow, Felix Fischer. Germany: 2018, S. 150-154.

Konferenzbeitrag › Konferenzpaper › 2018
A Novel Low Cost Wireless Incontinence Sensor System (Screen-Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials
Ngo, Ha Duong et al. In: A Novel Low Cost Wireless Incontinence Sensor System (Screen-Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials. Graz, Austria: 2018, S. 1-4.

Konferenzbeitrag › Konferenzpaper › 2018
Design and Application of a High-g Piezoresistive Acceleration Sensor for High Impact Application
Ngo, Ha Duong et al. In: Open Access Journal of Micro/Nano Sciences, Devices and Applications 2018, 2018 9 266. (2018), S. 1-8.

Artikel › Journalartikel › 2018
Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications
Ngo, Ha Duong et al. In: 51st International Symposium on Microelectronics. Pasadena, USA: 2018, S. 1-7.

Konferenzbeitrag › Konferenzpaper › 2018
Integrated impedance and permittivity based biosensors for cell density measurements
Lind, Monique et al. 5th BioProScale Symposium 2018 in Berlin: Innovative scale up and scale down for bioprocess intensification. 2018.

Konferenzbeitrag › Poster › 2018
Piezoresistive Pressure Sensors for Applications in Harsh Environments—A Roadmap
Ngo, Ha Duong et al. In: Modern Sensing Technologies . Springer Nature Switzerland AG: 2018, S. 231-251 .

Sammelbandbeitrag › Aufsatz › 2018
Silicon Micro Piezoresistive Pressure Sensors (Chapter 6)
Ngo, Ha Duong et al. In: Physical Sensors, Sensor Networks and Remote Sensing. Barcelona: 2018, S. 161-184.

Sammelbandbeitrag › Aufsatz › 2018
Simulation And Electrical Characterization Of A Novel 2D-Printed Incontinence Sensor With Conductive Polymer PEDOT:PSS For Medical Applications
Ngo, Ha Duong et al. In: Simulation And Electrical Characterization Of A Novel 2D-Printed Incontinence Sensor With Conductive Polymer PEDOT:PSS For Medical Applications. Singapore: 2018, S. 100-104.

Konferenzbeitrag › Konferenzpaper › 2018
Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS
Ngo, Ha Duong et al. In: Stress-Free Anodic Bonding Technology with SW-YY Glass for Sensitive MEMS . Singapore: 2018, S. 200-204.

Konferenzbeitrag › Konferenzpaper › 2018
A Novel Wafer-Level Packaging Method for a Direct-Backside- Exposure Pressure Sensor Anodically Bonded to a Silicon- Interposer with a Thin-Film Glass Layer
Mukhopadhyay, Biswajit et al. In: Proceedings Smart Systems Integration, Cork, Ireland, 8 – 9 March 2017. Cork, Ireland: 2017, S. 98-105.

Konferenzbeitrag › Konferenzpaper › 2017
Stress-Free Bonding Technology with Bondable Thin Glass layer for MEMS based Pressure Sensor
Ngo, Ha Duong et al. In: Conference Proceeding EPTC 2017. Singapore: 2017, S. 100-104.

Konferenzbeitrag › Konferenzpaper › 2017
The Roadmap for Develop of Piezoresistive Micro Mechanical Sensors for Harsh Environment Applications
Ngo, Ha Duong et al. In: Conference Proceeding ICST 2017. Sydney: 2017, S. 100-105.

Konferenzbeitrag › Konferenzpaper › 2017
Characterization of Anodic Bondable LTCC for Wafer-Level Packaging
Hu, Xiaodong et al. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Singapore: 2016, S. 501-505.

Konferenzbeitrag › Konferenzpaper › 2016
Development and fabrication of a very High-g sensor for very high impact applications
Ngo, Ha Duong et al. In: Journal of Physics: Conference Series. Proceedings of MME 2016. Cork: 2016, S. 130-134.

Konferenzbeitrag › Konferenzpaper › 2016
Development of a Novel High Reliable Si-Based Trace Humidity Sensor Array for Aerospace and Process Industry
Zhou, Shuyao et al. In: Sensors & Transducers Journal Vol. 207, Issue 12, December 2016. (2016), S. 30-35.

Artikel › Journalartikel › 2016
Embedding of wearable electronics into smart sensor insole
Hubl, Moritz et al. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Singapore: 2016, S. 597-601.

Konferenzbeitrag › Konferenzpaper › 2016
Embedding of wearable electronics into smart sensor insole
Hubl, Moritz et al. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Singapore: 2016, S. 354-359.

Konferenzbeitrag › Konferenzpaper › 2016
Energy-autarkic smart sensor insole for telemedical patient monitoring
Ngo, Ha Duong et al. In: Smart Systems Integration 2016. International Conference and Exhibition on integration of materials, devices and Systems - Proceedings. München: 2016, S. 262-268.

Konferenzbeitrag › Konferenzpaper › 2016
Investigation of residual stress effect during the anodic bonding process with different bondable materials for MEMS Wafer Level Packaging Design
Ehrmann, Oswin et al. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Singapore: 2016, S. 325-330.

Konferenzbeitrag › Konferenzpaper › 2016
Novel High Reliable Si-Based Trace Humidity Sensor Array for Aerospace and Process Industry
Ngo, Ha Duong et al. Barcelona: 2016, S. 100-103.

Konferenzbeitrag › Konferenzpaper › 2016
Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mukhopadhyay, Biswajit et al. In: Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Singapore: 2016, S. 354-359.

Konferenzbeitrag › Konferenzpaper › 2016
Routes to Graphene based Gas Sensors
Ngo, Ha Duong; Avnon, Asaf. In: International Conference on Structural Nano Composites. Aberdeen: 2016, S. 100-106.

Konferenzbeitrag › Konferenzpaper › 2016
Smarte Sensorschuheinlage für telemedizinisches Patientenmonitoring
Ngo, Ha Duong; Hubl, Moritz. In: Deutsche Zeitschrift für Klinische Forschung, Innovation und Praxis , Nr. 3/2016. (2016), S. 41-45.

Artikel › Journalartikel › 2016
Smarte Sensorschuheinlage für telemedizinisches Patientenmonitoring
Ngo, Ha Duong et al. In: Medizinisch-orthopädische Technik , Nr. 5/2016. (2016), S. 41-45.

Artikel › Journalartikel › 2016
Vitaldatenmessung mit smarter Sensorschuheinlage für die Telemedizin
Hubl, Moritz et al. In: Digitalisierung: Menschen zählen. Berlin: 2016, S. 274-279.

Sammelbandbeitrag › Aufsatz › 2016
Vitaldatenmessung mit smarter Sensorschuheinlage für die Telemedizin
Hubl, Moritz et al. In: Digitalisierung: Menschen zählen. Berlin: 2016, S. 274-279.

Sammelbandbeitrag › Aufsatz › 2016
WSi-WSiN-Pt metallization scheme for Silicon Carbide Based high temperature Microsystems
Ngo, Ha Duong et al. In: Journal os Micromachines Vol. 7, Issue 10. (2016), S. 1-9.

Artikel › Journalartikel › 2016
Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments
Ngo, Ha Duong et al. In: Sensors 2015 Volume 15, Issue 8. (2015), S. 20305-20315.

Artikel › Journalartikel › 2015
Circular Ion Sources for Plasma Enhanced Atomic Layer Deposition Applications
Ngo, Ha Duong et al. In: 58th Annual Technical Conference Proceedings. Santa Clara: 2015, S. 1040-1051.

Konferenzbeitrag › Konferenzpaper › 2015
HIpIms in full face erosion Circular Cathode for semiconductor Application. Best Paper Award Interactive
Papa, F. et al. Braunschweig: 2015, S. 200-204.

Konferenzbeitrag › Konferenzpaper › 2015
Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments
Ngo, Ha Duong et al. In: Proceedings AMA Conferences 2015 – SENSOR 2015 and IRS2 2015. Basel: 2015, S. 570-574.

Konferenzbeitrag › Konferenzpaper › 2015
Plasma Enhanced Atomic Layer Deposition by means of an Anode Layer Ion Source for Electronics Packaging Applications
Ngo, Ha Duong et al. In: Proceedings of the 17th Electronics Packaging Technology Conference. Singapur: 2015, S. 204-208.

Konferenzbeitrag › Konferenzpaper › 2015
Portable breath acetone monitoring system for wellness applications
Ngo, Ha-Duong et al. Dijon: 2015, S. 16-21.

Konferenzbeitrag › Konferenzpaper › 2015
Advanced liquid-free, piezoresistive, SOI-based pressure sensor concepts for measurements in harsh environments
Ngo, Ha-Duong et al. In: Microelectronic Packaging in the 21st century. Stuttgart: 2014, S. 387-391.

Sammelbandbeitrag › Aufsatz › 2014
Evaluation and Signal Conditioning of Piezoresistive Silicon Pressure Sensors
Ngo, Ha Duong et al. In: Applied Mechanics and Materials Band 530-531. (2014), S. 28-33.

Artikel › Journalartikel › 2014
Mechanical properties of individual composite PMMA multiwalled carbon nanotube nanofibers
Ngo, Ha Duong et al. In: IOP Conference Series: Materials Science and Engineering. Madrid, Spanien: 2014, S. 109-112.

Konferenzbeitrag › Konferenzpaper › 2014
Mechanical properties of individual composite PMMA-MWCNT Nanofibers
Ngo, Ha Duong et al. In: Materials Science and Engineering 64, 1. (2014), S. 12018-12023.

Artikel › Journalartikel › 2014
Neues Drucksensorkonzept mit Glasdurchführung (TGV) und Drucksensorbeaufschlagung auf der Rückseite der Si-Membran für den Einsatz in aggressiven Umgebungen
Ngo, Ha Duong et al. Nürnberg: 2014, S. 135-140.

Konferenzbeitrag › Konferenzpaper › 2014
Quasi one dimensional transport in composite electrospun nanofibers
Ngo, Ha Duong et al. In: Journal of Applied Physics (AIP) Volume 4, 1. (2014), S. 017110-1-017110-6.

Artikel › Journalartikel › 2014
SOI-based, High Reliable Pressure Sensor with Floating Concept for High Temperature Applications
Ngo, Ha-Duong et al. In: Procedia Engineering. Brescia, Italien: 2014, S. 720–723.

Konferenzbeitrag › Konferenzpaper › 2014
Tuning piezo ion channels to detect molecular-scale movements relevant for fine touch
Poole, Kate et al. In: Nature Communications 5, 3520. (2014), S. 1-14.

Artikel › Journalartikel › 2014
Wireless Pressure Sensor System
Ngo, Ha Duong et al. In: Applied Mechanics and Materials Band 530-531. (2014), S. 75-79.

Artikel › Journalartikel › 2014
Zero Bias Anomaly in an Individual Suspended Electrospun Nanofiber
Ngo, Ha Duong et al. In: Materials Science and Engineering 64, 1. (2014), S. 12001-12007.

Artikel › Journalartikel › 2014
An advanced MEMS sensor packaging concept for use in harsh environments
Ngo, Ha Duong et al. In: Proceeding of 15. Electronic Packaging Technology Conference. Singapore: 2013, S. 103-107.

Konferenzbeitrag › Konferenzpaper › 2013
Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Höppner, Katrin et al. In: Journal of Physics: Conference Series. London, UK: 2013, S. 12086-12090.

Konferenzbeitrag › Konferenzpaper › 2013
MEMS pressure sensor with maximum performances by using novel back-side direct-exposure concept featuring through glass vias
Ngo, Ha Duong. In: Proceedings of SPIE 8763, Smart Sensors, Actuators, and MEMS VI. Grenoble, Frankreich: 2013, S. 6-11.

Konferenzbeitrag › Konferenzpaper › 2013
Thermal Design of a Tristable Electromagnetic Linear Microactuator with High Displacement and Low Actuation Force for Mass Storage Applications
Ngo, Ha Duong. In: Proceedings of SPIE 8763, Smart Sensors, Actuators, and MEMS VI. Grenoble, Frankreich: 2013, S. 13-18.

Konferenzbeitrag › Konferenzpaper › 2013
Copper Filling Of TSVs For Interposer Applications
Ngo, Ha Duong. Singapore: 2012, S. 112-116.

Konferenzbeitrag › Konferenzpaper › 2012
Liquid-free SOI-based piezoresistive pressure sensor for measurement up to 400°C
Ngo, Ha Duong. Taichung, Taiwan: 2012, S. 100-114.

Konferenzbeitrag › Konferenzpaper › 2012
Thermal analysis on silicon photonics integrated MZI modulator and driver
Ngo, Ha Duong et al. Belgium: 2012, S. 1-6.

Konferenzbeitrag › Konferenzpaper › 2012

Kontakt

Prof. Dr.-Ing. Ha Duong Ngo

Rufnummer: +49 30 5019-3413

HaDuong.Ngo@HTW-Berlin.de

Campus Wilhelminenhof

WH Gebäude C, 525

Wilhelminenhofstraße 75A

12459 Berlin

Hochschule für Technik und Wirtschaft Berlin

University of Applied Sciences

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